Product specification
4
Chip Resistor Surface Mount
RC
SERIES
0402
9
MARKING
RC0402
No marking
ynsc007
Fig. 1
For further marking information, please see special data sheet “Chip resistors marking ”
CONSTRUCTION
The resistor is constructed on top
O U T L I N E S
of a high-grade ceramic body.
Internal metal electrodes are added
on each end to make the contacts to
the thick film resistive element. The
composition of the resistive element
is a noble metal imbedded into a
glass and covered by a second glass
to prevent environment influences.
The resistor is laser trimmed to the
rated resistance value. The resistor
is covered with a protective epoxy
coat, finally the two external
terminations (matte tin on Ni-
barrier) are added. See fig.2
DIMENSIONS
Table 1
For dimension see Table 1
H
I2
I 1
W
L
overcoat
Primary glass layer
resistive layer
(Jumper chip is a conductor)
inner electrode
termination(Ni/matte tin)
ceramic substrate
overcoat
YNSC056
TYPE
L (mm)
W (mm)
H (mm)
I 1 (mm)
I 2 (mm)
RC0402
1.00 ±0.05
0.50 ±0.05
0.35 ±0.05
0.20 ±0.10
0.25 ±0.10
Fig. 2 Chip resistor outlines
www.yageo.com
Jan 05, 2011 V.6
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